Raise3D DF2+ Solution - Complete Package

Raise3D DF2+ Complete Package – The all-around system for professional resin 3D printing

All in one – from the first layer to the finished part.

The Raise3D DF2+ Complete Package is the comprehensive all-in-one solution for industrial resin 3D printing. It contains everything you need for a seamless, automated workflow – from printing to washing and curing to clean post-processing. Ideal for professional users, development departments, and small series production.

All inclusive – one system, one process

The package includes:
Raise3D DF2+ DLP printer, DF Wash, DF Cure, Auto-Feeding Station, Finish Box, Waste Container and Tool Box – complemented by the free slicing software ideaMaker.
This lets you start directly with the production-ready resin workflow – without additional devices or adjustments.

Smart RFID workflow for maximum process reliability

Thanks to the integrated RFID technology, the system automatically detects resin type and process parameters and transfers them to all stations – from printing to washing to curing. This reduces errors, saves time, and creates full traceability of your parts.

Precision, speed, and durability

The DF2+ operates with the latest DLP technology (2560 × 1440 px) and a 20% higher print speed compared to the previous model. The redesigned high-performance light engine ensures durable, even exposure and the highest dimensional accuracy – perfect for series parts, tools, or technical prototypes.

Seamless post-processing workflow

• DF Wash: Automated cleaning with adjustable cycles and integrated waste container.

• DF Cure: Uniform curing thanks to 360° light field and temperature control.

• Finish Box: Clean post-processing with organized tool set.

Together they form a continuous, traceable process – from liquid resin to ready-to-use component.

Technical highlights

• Printing technology: Digital Light Printing (DLP, 405 nm)

• Build volume: 200 × 112 × 300 mm

• XY resolution: 2560 × 1440 pixels

• Print speed: up to 100 mm/h (+20% vs. DF2)

• Layer height: 50 – 200 µm

• RFID system: Automatic parameter and resin recognition

• Resin management: Auto Feeding, Level Detection, Resin Confirmation

• Chamber heating: up to 40 °C

• Connectivity: Wi-Fi | LAN | USB | RaiseCloud

• Software: ideaMaker (free license included)

• Warranty: 1 year standard warranty

For professional results – ready to use immediately

The Raise3D DF2+ Complete Package combines state-of-the-art DLP technology, intelligent automation, and efficient post-processing in a single system.
Perfect for engineers, product developers, and manufacturers who demand precise, repeatable results without compromise.

Raise3D DF2+ Complete Package – From resin to finished part.