Bondtech Bondtech BMG-HT for Funmat HT

Bondtech BMG-HT – High Temperature Extruder for Funmat HT

The Bondtech BMG-HT is a professional upgrade kit for the Intamsys Funmat HT. With an aluminum housing, high-temperature pancake stepper (up to 150 °C), and the proven Dual Drive System, it ensures reliable extrusion, fewer material issues, and better print quality – even with demanding high-temperature materials.

Highlights & Benefits

• High temperature capable: Extruder usable up to 150 °C chamber environment.
• Light & stable: Aluminum housing & pancake stepper reduce weight by over 35%.
• More power: 3:1 gear ratio for higher pushing force & more precise extrusion.
• Dual Drive technology: Prevents filament slipping & ensures constant flow.
• Better print quality: Less wear, cleaner surfaces & higher print speed.
• Optimized for Funmat HT: Custom upgrade for maximum performance.

Professional Upgrade for Funmat HT

The BMG-HT Kit makes the Funmat HT more reliable and powerful. Under-extrusion, slipping, or filament abrasion are a thing of the past – thanks to the state-of-the-art Dual Drive System. The robust and temperature-resistant design is perfect for industrial applications.

Less Weight – More Performance

By combining the aluminum housing and light pancake stepper, the weight of the print head drops from over 400 g to under 260 g – a reduction of more than 35%. Benefits: less strain on linear guides, better surface quality, and the ability to print at higher speeds.

Dual Drive Extrusion

The proven Bondtech Dual Drive System guarantees consistent extrusion and optimal material feeding – regardless of filament type. Even abrasive or flexible materials are processed safely and precisely.

Technical Data

Order the Bondtech BMG-HT now and equip the Funmat HT with more reliability, higher extrusion performance, and optimized print quality.